I got to do my first business travel for this role. We went to Seattle for the DARPA ERI 2.0 Summit. DARPA is mainly focused on defense, but health care/medical devices and defense/electronics tend to have similar challenges: small, smart, data processing, longevity, etc.
The trip was great timing – it was EXTREMELY hot in Minneapolis and amazingly cool in Seattle. I got in a little before dinner time Monday night, rode the light rail to downtown where we were staying and grabbed dinner with a coworker.
What is ERI
The Electronics Resurgence Initiative (ERI), DARPA’s response to national-level microelectronics concerns, is designed to ensure U.S. leadership in cross-functional, next-generation microelectronics research, development, and manufacturing. The initiative, aimed at both national security capabilities and commercial economic competitiveness and sustainability, is a thematic portfolio of research programs primarily in the Microsystems Technology Office (MTO). These programs emphasize forward-looking partnerships with U.S. industry, the defense industrial base, and university researchers.
DARPA expanded ERI’s focus with the announcement of ERI 2.0, which seeks to reinvent domestic microelectronics manufacturing. ERI 2.0 will strengthen DARPA’s leadership in driving the next generation of microelectronics for national security by creating a national capability for 3DHI manufacturing and pursuing focused research in:
- Manufacturing complex 3D systems
- Developing electronics for extreme environments
…while maintaining the following thrust areas:
- Optimizing design and test for complex circuits and prototypes
- Overcoming security threats across the entire hardware lifecycle
- Increasing information processing density and efficiency
- Accelerating innovation in artificial intelligence hardware to make decisions at the edge faster
- Securing communications
Summit Agenda
Tuesday, August 22, 2023
7:00am-3:30pmRegistration Check-In7:00am-8:30amNetworking Breakfast8:30am-8:40amDay 1 Welcome
Senator Maria Cantwell, United States Senator for the State of Washington and Chair of the Senate Committee on Commerce, Science, and Transportation
Dr. Carl McCants, Electronics Resurgence Initiative (ERI) Special Assistant to the Defense Advanced Research Projects Agency (DARPA) Director8:40am-8:55amDay 1 Introductory RemarksDr. Stefanie Tompkins, Director, DARPA
Dr. Mark Rosker, Director, DARPA Microsystems Technology Office (MTO)8:55am-9:15amOpening SessionMr. Patrick Gelsinger, Chief Executive Officer, Intel Corporation9:15am-10:05amCHIPS ActDr. Laurie Locascio, Under Secretary of Commerce for Standards and Technology; Director, National Institute of Standards and Technology (NIST)
Dr. Margaret Martonosi, Assistant Director for Computer and Information Science and Engineering, U.S. National Science Foundation
Dr. Lora Weiss, Director, CHIPS Research & Development Program Office
Dr. Andrew Schwartz, Director, Materials Sciences and Engineering Division, Department Of Energy Office of Basic Energy Sciences10:05am-10:20amDARPA StrategyDr. Mark Rosker, Director, DARPA/MTO10:20am-10:50amMorning Break10:50am-12:05pmCreating the 3D Microsystems of TomorrowSession Introduction
Dr. Anna Tauke-Pedretti, Program Manager, DARPA/MTO
New Applications Enabled by Complex 3D Microsystems
Dr. Joshua Fryman, Fellow, Intel Corporation
Development of a 3DHI Ecosystem
Moderator: Dr. Anna Tauke-Pedretti, Program Manager, DARPA/MTO
Dr. William Phillips, Senior Director of Advanced Missions, Northrop Grumman Mission Systems
Dr. Philip Wong, Professor of Electrical Engineering, Stanford University
Dr. Mark Horowitz, Professor of Electrical Engineering and Computer Science, Stanford University
Lightning Talk: Challenges and Solutions to Failure Analysis in 3D Microsystems
Mr. Justin Ford, Manager, Novel Firing Set Solutions Department, Sandia National Laboratories presenting on behalf of
Dr. Edward Cole, Fellow, Sandia National Laboratories
Lightning Talk: Challenges and Solutions to Thermal Management in 3D Microsystems
Dr. Muhannad Bakir, Professor of Electrical and Computer Engineering, Georgia Institute of Technology
Lightning Talk: Challenges and Solutions to DATA I/O
Dr. Keren Bergman, Professor of Electrical Engineering; Scientific Director, Center for Integrated Science and Engineering, Department of Electrical Engineering, Columbia University
NGMM Phase 0 Review
Dr. Carl McCants, ERI Special Assistant to the DARPA Director12:05pm-1:20pmNetworking Lunch1:20pm-2:20pm3D IC EDA: What is Needed, and How/When Can We Deliver?Session Introduction
Dr. Sung Kyu Lim, Program Manager, DARPA/MTO
3DHI for Aerospace and Defense Applications: State-of-the-Art Edge Computing and High-Bandwidth Communications
Mr. Timothy Lee, Technical Fellow, Boeing
Low-Cost & Design-Flexible 3D-IC Packaging Solutions
Dr. Vincent (WooPoung) Kim, Corporate Executive Vice President and Head of Packaging Solution Center, Samsung Electronics U.S.
Challenges & Opportunities in 3D IC Test
Dr. Pooya Tadayon, Fellow and Director of Assembly and Test Pathfinding, Intel Corporation
Lightning Talk: Latest Results and Upcoming Challenges in Simulation of 3D ICs
Dr. Elaine Tang, Senior Key Expert, Siemens Corporation
Lightning Talk: Latest Results and Upcoming Challenges in Physical Design of 3D ICs
Mr. Vinay Patwardhan, Product Management Group Director, Digital Implementation and 3D-IC, Cadence Design Systems
Lightning Talk: Latest Results and Upcoming Challenges in Architecture and Synthesis for 3D ICs
Dr. Rob Aitken, Distinguished Architect, Synopsys2:20pm-2:45pmAfternoon Break2:45pm-3:00pmJUMP 2.0 OverviewDr. Todd Younkin, President and Chief Executive Officer, Semiconductor Research Corporation3:00pm-3:05pmForward-Looking ExperimentationDr. Dev Palmer, Deputy Director, DARPA/MTO3:55pm-4:00pmClosing RemarksDr. Dev Palmer, Deputy Director, DARPA/MTO4:15pm-4:45pmTravel to Seattle Center Armory (Bus transportation provided)Please meet at 4:15 outside of the Hyatt Regency Seattle for boarding4:30pm-6:00pm2023 ERI Summit Welcome Reception6:00pm-6:30pmReturn to Hyatt Regency Seattle (Bus transportation provided)Please meet at the bus drop-off loop for boarding; buses to loop round-trip until 7:00pm
Wednesday, August 23, 2023
7:00am-4:30pmRegistration Check-In7:00am-8:30amNetworking Breakfast8:30am-8:40amDay 2 Welcome and Introductory RemarksCongressman Adam Smith, United States Representative for Washington’s Ninth Congressional District and Ranking Member of the House Armed Services Committee
Dr. Carl McCants, ERI Special Assistant to the DARPA Director8:40am-9:00amGovernment Morning SessionThe Honorable Heidi Shyu, Under Secretary of Defense for Research and Engineering (OUSD(R&E)); Chief Technology Officer for the Department of Defense (DoD)9:00am-9:20amIndustry Morning SessionDr. Bill Dally, Chief Scientist and Senior Vice President of Research, NVIDIA Corporation9:20am-10:35amEdge Intelligence Under UncertaintySession Introduction
Mr. John Davies, Program Manager, DARPA/MTO
Lightning Talk: How to Efficiently Learn On-Device?
Dr. Priya Panda, Assistant Professor of Electrical Engineering, Yale University
Next-Generation AI Hardware for Future Microsystems
Dr. Mukesh Khare, General Manager, IBM Semiconductors; Vice President, Hybrid Cloud, IBM
Lightning Talk: Low-power Sensing and Compute: Opportunities and Challenges
Dr. Naveen Verma, Professor of Electrical and Computer Engineering, Princeton; Director, Keller Center for Innovation in Engineering Education
Lightning Talk: Enabling Confidence in AI
Dr. Bryan Jacobs, Program Manager, DARPA/MTO
Demonstration: Domain Specific System on a Chip (DSSoC) HW and SW
Dr. Thomas Kazior, Program Manager, DARPA/MTO – Introducing video by International Business Machines (IBM)
Biologically-Defined Limits of Edge Computing
Moderator: Mr. John Davies, Program Manager, DARPA/MTO
Dr. Eric Klavins, Professor and Chair, Electrical and Computer Engineering Department, University of Washington
Dr. Andreas Tolias, Professor of Neuroscience, Baylor College of Medicine; Founder and Director, Center for Neuroscience and Artificial Intelligence
Dr. Ron Weiss, Professor of Biological Engineering, Massachusetts Institute of Technology
In-Pixel Computing for the Extreme-Edge
Dr. Ajey Jacob, Director, Computational Systems and Technology Division at the University of Southern California Information Sciences Institute10:35am-11:05amOptional Break with RefreshmentsTo allocate time for yesterday’s missed presentations, sessions will continue throughout the morning break. Food/refreshments will be available and should be consumed only in the lobby area from 10:35am – 11:05am10:35am-10:50amInternational Supply ChainTechnical Innovations to Improve Supply Chain Security
Dr. PR “Chidi” Chidambaram, Vice President of Engineering and Fellow, Qualcomm10:50am-11:05amGovernment Morning SessionMr. Stephen Welby, Deputy Director for National Security, White House Office of Science and Technology Policy (OSTP)11:05am-12:20pmSecurity in the Face of Microelectronics Supply ChainSession Introduction
Dr. James Wilson, Program Manager, DARPA/MTO
Lightning Talk: Microelectronics Threats and Vulnerabilities – DoD
Mr. Adam Hauch, Microelectronics Security and Counterintelligence Support Technical Lead, U.S. DoD
Lightning Talk: Commercial Microelectronics Security Challenges
Mr. Jason Moore, Engineering Senior Director, Advanced Micro Devices (AMD)
Real-World Security in Practice
Dr. Benjamin Cyr, Senior R&D Cybersecurity Engineer, Sandia National Laboratories
Security Challenges After Integration
Moderator: Dr. Lok Yan, Program Manager, DARPA/MTO
Ms. Cheri Caddy, Deputy Assistant National Cyber Director for Cyber Technology, R&D, Office of the National Cyber Director
Dr. Kevin Fu, Professor of Electrical and Computer Engineering, Computer Sciences, and Bioengineering, Northeastern University and KRI Kostas Research Institute for Homeland Security
Mr. Jason Williams, Co-Founder and Chief Executive Officer, Cromulence, LLC
No Trade-off Necessary: Security, Performance, Ultra-Low Energy, and Assurance
Dr. Joseph Kiniry, Principal Scientist, Galois
Demo: Galois’s 21CC Project
Lightning Talk: Protecting Data with Encryption
Dr. Kurt Rohloff, Co-Founder and Chief Technology Officer, Duality Technologies12:20pm-12:30pmDARPA Session
Importance of Microelectronics in the Strategic Technology Office
Dr. Whitney Mason, Deputy Director, DARPA/STO12:30pm-12:40pmInternational Supply ChainSupply Chain Challenges – Defense Systems
Dr. Bill Carter, Vice President, Materials and Manufacturing Technology, Boeing12:40pm-2:30pmPoster/Demo Lunch SessionPlease visit the demos and posters in our Exhibit Hall for live group discussions with program managers and performers.2:30pm-3:00pm(Meet Us At) The Intersection of Mission and CommerceSession Introduction
Dr. Todd Bauer, Program Manager, DARPA/MTO
Challenges & Opportunities for VLSI Electronics Operating in Cryogenic Environments
Dr. Daniel Friedman, Senior Manager and Distinguished Research Scientist, Communication Circuits and Systems, IBM
High Temperature: The Next Frontier of Computing for a Cleaner World
Dr. Matt Francis, President and Chief Executive Officer, Ozark Integrated Circuits, Inc.3:00pm-3:30pmConnecting Technology to Future System Needs3D Microelectronics Research and Packaging
Dr. Patty Chang-Chien, Vice President and General Manager, Boeing Research and Technology
Impact of 3D Heterogeneously Integrated Microsystems on Analog, Mixed-Signal, and RF Applications and Capabilities
Dr. Ahmad Bahai, Senior Vice President and Chief Technology Officer, Texas Instruments3:30pm-3:50pmAfternoon Break3:50pm-4:00pmDARPA SessionDr. Dev Palmer, Deputy Director, DARPA/MTO4:00pm-4:20pmClosing SessionMr. Mark Papermaster, Chief Technology Officer and Executive Vice President, AMD4:20pm-4:30pmClosing RemarksDr. Mark Rosker, Director, DARPA/MTO4:30pm-5:30pmPoster/Demo Networking Reception5:30pm-6:30pmMTO Recruitment Information ReceptionPlease meet on the 7th Floor Foyer of the Hyatt Regency Seattle6:30pmDay 2 Concludes
Thursday, August 24, 2023
Workshop descriptions located within the “Workshops” page underneath “Conference Details”7:00am-8:30amBreakfast8:30am-3:30pmAll-Day WorkshopsA New Approach to Microelectronics Workforce Development for Government
Dr. James Wilson, Program Manager, DARPA/MTO
Room: 501 Chiwawa – 5th Floor
Putting the Rad in Radiation Effects
Dr. Todd Bauer, Program Manager, DARPA/MTO
Room: 512 Willapa – 5th Floor
Quantum Integrated Photonics – Opportunities and Challenges
Dr. Justin Cohen / Dr. Jonathan Hoffman / Dr. Gordon Keeler, Program Managers, DARPA/MTO
Room: Columbia C – 3rd Floor
Revolutionizing RF/mmWave Design Automation Through Development and Application of Artificial Intelligence and Machine Learning Tools
Dr. Sung Kyu Lim / Dr. Thomas Kazior, Program Managers, DARPA/MTO
Room: Elwha A – 5th Floor
The Materials Genome Initiative & Microelectronics: Designing the Next Generation of Materials
Dr. James Warren, Director of the Materials Genome Project, National Institute of Standards and Technology (NIST)
Room: 302 Beckler – 3rd Floor
Next-Generation Microelectronics Manufacturing (NGMM) Phase 0
Dr. Carl McCants, ERI Special Assistant to the DARPA Director / Mr. John Blevins, Program Manager, DARPA/MTO
Room: Columbia A – 3rd Floor
8:30am-11:30amHalf-Day WorkshopsCommercial Strategy’s Role in Accelerating Innovations in Next Generation Microelectronics
Col Charles Bris-Bois, USAF, DARPA Commercial Strategy
Room: 506 Samish – 5th Floor
Continuous Collaborative Learning in the Spectrum
Mr. John Davies, Program Manager, DARPA/MTO
Room: Columbia D – 3rd Floor
DARPA Connect
Dr. William Kiser, Executive Vice President, Science and Technology, Applied Research Institute (ARI) / Dr. Ben Griffin, Program Manager, DARPA/MTO
Room: 505 Queets – 5th Floor
Emerging Thermal Metrology Needs for 3DHI Microsystems
Dr. Thomas Kazior / Dr. Yogendra Joshi, Program Managers, DARPA/MTO
Room: Elwha B – 5th Floor
Novel Architectures for Neuro-Symbolic Computation
Dr. Alvaro Velasquez, Program Manager, DARPA/I2O
Room: 502 Cowlitz – 5th Floor
Opportunities and Needs for Cryogenic Computing
Dr. Jason Woo, Program Manager, DARPA/MTO
Room: Quinault – 5th Floor
Microelectronics, Power Electronics & Cybersecurity: Securing the Electric Vehicle and Vehicle Telematics Ecosystem
Ms. Cheri Caddy, Deputy Assistant National Cyber Director for Cyber Technology, Research & Development, ONCD, The White House
Room: 507 Sauk – 5th Floor9:45am-10:15amMorning Break11:30am-12:30pmLunch12:30pm-3:30pmHalf-Day Workshops3D Optoelectronics
Dr. Anna Tauke-Pedretti, Program Manager, DARPA/MTO
Room: Quinault – 5th Floor
DARPA Connect
Dr. William Kiser, Executive Vice President, Science and Technology, Applied Research Institute (ARI) / Dr. Ben Griffin, Program Manager, DARPA/MTO
Room: 505 Queets – 5th Floor
Physics Inspired Computing
Dr. Bryan Jacobs, Program Manager, DARPA/MTO
Room: 502 Cowlitz – 5th Floor
Securing the U.S. Electronics Supply Chain
Mr. Mike Sangillo, Program Manager, DARPA/MTO
Room: Columbia D – 3rd Floor
Thermal Innovations for Next Generation Space-Based Electronics
Dr. Thomas Kazior / Dr. Yogendra Joshi, Program Managers, DARPA/MTO
Room: Elwha B – 5th Floor
1:45pm-2:15pm
Afternoon Break
3:30pm
Adjourn
What is DARPA
The Defense Advanced Research Projects Agency (DARPA) is a research and developmentagency of the United States Department of Defense responsible for the development of emerging technologies for use by the military.
The agency was created on February 7, 1958, by President Dwight D. Eisenhower in response to the Soviet launching of Sputnik 1in 1957. By collaborating with academia, industry, and government partners, DARPA formulates and executes research and development projects to expand the frontiers of technology and science, often beyond immediate U.S. military requirements.
I am specifically working with: The Microsystems Technology Office (MTO) core mission is the development of high-performance, intelligent microsystems and next-generation components to ensure U.S. dominance in Command, Control, Communications, Computer, Intelligence, Surveillance, and Reconnaissance (C4ISR), Electronic Warfare (EW), and Directed Energy (DE). The effectiveness, survivability, and lethality of systems that relate to these applications depend critically on microsystems and components.
I struggled to fall asleep the first night, so I stayed up and read quite late. I was up bright and early and down in the breakfast area getting some work done before heading over to the conference.
The first day was long – although we got interrupted towards the end when we all had to be evacuated for the fire alarm. We were able to head back in, but it was close to the time when we had to load busses up for the networking event. The networking event was held at the Armory – the whole place was rented out for mingling with some light dinner food provided. We decided to walk back after the event instead of riding the busses. We all called it an early night. I walked around a little bit outside in search of ice cream, but ended up going back to my room when there was no where close to get anything.
Wednesday morning, I woke up super early to walk/run over to the Orange Theory Fitness that was about .75 miles from the hotel. I was out the door around 4:40am to make it to the 5am class.
I had originally planned to walk over, but there were quite a few people gathered around a church by the hotel and in a few other places that led me to pick up the pace. I was growled at by one person who had been sleeping, so I jogged on over and got to the studio a little early. The workout was a great way to start the morning! My calories burned seemed so high though..
I walk/ran back to the hotel after the class with a stop for a latte and a donut. I had to be showered and on a call to present at 7am Seattle time. After the presentation, I headed over to the conference for another day of presentations.
After the conference adjourned for the evening, we headed back to the hotel to change before heading out for a walk to find some dinner. It ended up being a lovely, long walk that detoured to a little rocky beach.
Unfortunately, Hailey was really missing me that night and unable to fall asleep. I FaceTimed her for a short time and then was texting with Joel as he was struggling to get her to fall asleep. She just wanted to ‘hug mommy’. It was heartbreaking.
After sitting at the beach and enjoying the view and the weather, we started our trek to find some dinner. We ended up a Middle Eastern restaurant that was delicious. We walked back to the hotel and called it a night.
The next morning, I met a very, very fast coworker down in the lobby for a run. Translation: we would sort of run together just to get to the running paths and then split.
The weather was great! We ran through the Gum Wall (gross!!!) and by the Market. I saw one of the giant shipyards and sent a picture to Joel, since he deals with that stuff for work. I finished the run by walking up a crazy steep hill and almost getting lost trying to find the hotel.
We all got packed up and headed over to the conference for the last day. We split up to go to different workshops. Around 3, we headed to the light rail station to get to the airport for our flights. The airport was nuts! I was flying Alaskan Air, which I have not done before, so ended up splitting from everyone. After standing in the security line for 15 minutes and not moving, some airport workers sent us to a different checkpoint that was using dogs to help speed up the process. We flex through those lines.
I found my coworkers again after getting through security and we had a quick dinner before I had to head to my gate. The flight was uneventful – there were no TVs or anything, so I ended up finishing a book and starting another one.
I landed around midnight and finally made it home around 1am. It was great to be back home and see the kiddos when they woke up, but man was I tired! I took a very long nap after working a few hours Friday morning.