Seattle Trip | August 2023

The Electronics Resurgence Initiative (ERI), DARPA’s response to national-level microelectronics concerns, is designed to ensure U.S. leadership in cross-functional, next-generation microelectronics research, development, and manufacturing. The initiative, aimed at both national security capabilities and commercial economic competitiveness and sustainability, is a thematic portfolio of research programs primarily in the Microsystems Technology Office (MTO). These programs emphasize forward-looking partnerships with U.S. industry, the defense industrial base, and university researchers.

DARPA expanded ERI’s focus with the announcement of ERI 2.0, which seeks to reinvent domestic microelectronics manufacturing. ERI 2.0 will strengthen DARPA’s leadership in driving the next generation of microelectronics for national security by creating a national capability for 3DHI manufacturing and pursuing focused research in:

• Manufacturing complex 3D systems
• Developing electronics for extreme environments

…while maintaining the following thrust areas:

• Optimizing design and test for complex circuits and prototypes
• Overcoming security threats across the entire hardware lifecycle
• Increasing information processing density and efficiency
• Accelerating innovation in artificial intelligence hardware to make decisions at the edge faster
• Securing communications

Tuesday, August 22, 2023

7:00am-3:30pmRegistration Check-In7:00am-8:30amNetworking Breakfast8:30am-8:40amDay 1 Welcome
Senator Maria Cantwell, United States Senator for the State of Washington and Chair of the Senate Committee on Commerce, Science, and Transportation
Dr. Carl McCants, Electronics Resurgence Initiative (ERI) Special Assistant to the Defense Advanced Research Projects Agency (DARPA) Director8:40am-8:55amDay 1 Introductory RemarksDr. Stefanie Tompkins, Director, DARPA
Dr. Mark Rosker, Director, DARPA Microsystems Technology Office (MTO)8:55am-9:15amOpening SessionMr. Patrick Gelsinger, Chief Executive Officer, Intel Corporation9:15am-10:05amCHIPS ActDr. Laurie Locascio, Under Secretary of Commerce for Standards and Technology; Director, National Institute of Standards and Technology (NIST)

Dr. Margaret Martonosi, Assistant Director for Computer and Information Science and Engineering, U.S. National Science Foundation
Dr. Lora Weiss, Director, CHIPS Research & Development Program Office
Dr. Andrew Schwartz, Director, Materials Sciences and Engineering Division, Department Of Energy Office of Basic Energy Sciences10:05am-10:20amDARPA StrategyDr. Mark Rosker, Director, DARPA/MTO10:20am-10:50amMorning Break10:50am-12:05pmCreating the 3D Microsystems of TomorrowSession Introduction
Dr. Anna Tauke-Pedretti, Program Manager, DARPA/MTO

New Applications Enabled by Complex 3D Microsystems
Dr. Joshua Fryman, Fellow, Intel Corporation

Development of a 3DHI Ecosystem
Moderator: Dr. Anna Tauke-Pedretti, Program Manager, DARPA/MTO
Dr. William Phillips, Senior Director of Advanced Missions, Northrop Grumman Mission Systems
Dr. Philip Wong, Professor of Electrical Engineering, Stanford University
Dr. Mark Horowitz, Professor of Electrical Engineering and Computer Science, Stanford University

Lightning Talk: Challenges and Solutions to Failure Analysis in 3D Microsystems
Mr. Justin Ford, Manager, Novel Firing Set Solutions Department, Sandia National Laboratories presenting on behalf of
Dr. Edward Cole, Fellow, Sandia National Laboratories

Lightning Talk: Challenges and Solutions to Thermal Management in 3D Microsystems
Dr. Muhannad Bakir, Professor of Electrical and Computer Engineering, Georgia Institute of Technology

Lightning Talk: Challenges and Solutions to DATA I/O
Dr. Keren Bergman, Professor of Electrical Engineering; Scientific Director, Center for Integrated Science and Engineering, Department of Electrical Engineering, Columbia University

NGMM Phase 0 Review
Dr. Carl McCants, ERI Special Assistant to the DARPA Director12:05pm-1:20pmNetworking Lunch1:20pm-2:20pm3D IC EDA: What is Needed, and How/When Can We Deliver?Session Introduction
Dr. Sung Kyu Lim, Program Manager, DARPA/MTO

3DHI for Aerospace and Defense Applications: State-of-the-Art Edge Computing and High-Bandwidth Communications
Mr. Timothy Lee, Technical Fellow, Boeing

Low-Cost & Design-Flexible 3D-IC Packaging Solutions
Dr. Vincent (WooPoung) Kim, Corporate Executive Vice President and Head of Packaging Solution Center, Samsung Electronics U.S.

Challenges & Opportunities in 3D IC Test
Dr. Pooya Tadayon, Fellow and Director of Assembly and Test Pathfinding, Intel Corporation

Lightning Talk: Latest Results and Upcoming Challenges in Simulation of 3D ICs
Dr. Elaine Tang, Senior Key Expert, Siemens Corporation

Lightning Talk: Latest Results and Upcoming Challenges in Physical Design of 3D ICs
Mr. Vinay Patwardhan, Product Management Group Director, Digital Implementation and 3D-IC, Cadence Design Systems

Lightning Talk: Latest Results and Upcoming Challenges in Architecture and Synthesis for 3D ICs
Dr. Rob Aitken, Distinguished Architect, Synopsys2:20pm-2:45pmAfternoon Break2:45pm-3:00pmJUMP 2.0 OverviewDr. Todd Younkin, President and Chief Executive Officer, Semiconductor Research Corporation3:00pm-3:05pmForward-Looking ExperimentationDr. Dev Palmer, Deputy Director, DARPA/MTO3:55pm-4:00pmClosing RemarksDr. Dev Palmer, Deputy Director, DARPA/MTO4:15pm-4:45pmTravel to Seattle Center Armory (Bus transportation provided)Please meet at 4:15 outside of the Hyatt Regency Seattle for boarding4:30pm-6:00pm2023 ERI Summit Welcome Reception6:00pm-6:30pmReturn to Hyatt Regency Seattle (Bus transportation provided)Please meet at the bus drop-off loop for boarding; buses to loop round-trip until 7:00pm

Wednesday, August 23, 2023

7:00am-4:30pmRegistration Check-In7:00am-8:30amNetworking Breakfast8:30am-8:40amDay 2 Welcome and Introductory RemarksCongressman Adam Smith, United States Representative for Washington’s Ninth Congressional District and Ranking Member of the House Armed Services Committee
Dr. Carl McCants, ERI Special Assistant to the DARPA Director8:40am-9:00amGovernment Morning SessionThe Honorable Heidi Shyu, Under Secretary of Defense for Research and Engineering (OUSD(R&E)); Chief Technology Officer for the Department of Defense (DoD)9:00am-9:20amIndustry Morning SessionDr. Bill Dally, Chief Scientist and Senior Vice President of Research, NVIDIA Corporation9:20am-10:35amEdge Intelligence Under UncertaintySession Introduction
Mr. John Davies, Program Manager, DARPA/MTO

Lightning Talk: How to Efficiently Learn On-Device?
Dr. Priya Panda, Assistant Professor of Electrical Engineering, Yale University

Next-Generation AI Hardware for Future Microsystems
Dr. Mukesh Khare, General Manager, IBM Semiconductors; Vice President, Hybrid Cloud, IBM

Lightning Talk: Low-power Sensing and Compute: Opportunities and Challenges
Dr. Naveen Verma, Professor of Electrical and Computer Engineering, Princeton; Director, Keller Center for Innovation in Engineering Education

Lightning Talk: Enabling Confidence in AI
Dr. Bryan Jacobs, Program Manager, DARPA/MTO

Demonstration: Domain Specific System on a Chip (DSSoC) HW and SW
Dr. Thomas Kazior, Program Manager, DARPA/MTO – Introducing video by International Business Machines (IBM)

Biologically-Defined Limits of Edge Computing
Moderator: Mr. John Davies, Program Manager, DARPA/MTO
Dr. Eric Klavins, Professor and Chair, Electrical and Computer Engineering Department, University of Washington
Dr. Andreas Tolias, Professor of Neuroscience, Baylor College of Medicine; Founder and Director, Center for Neuroscience and Artificial Intelligence
Dr. Ron Weiss, Professor of Biological Engineering, Massachusetts Institute of Technology

In-Pixel Computing for the Extreme-Edge
Dr. Ajey Jacob, Director, Computational Systems and Technology Division at the University of Southern California Information Sciences Institute10:35am-11:05amOptional Break with RefreshmentsTo allocate time for yesterday’s missed presentations, sessions will continue throughout the morning break. Food/refreshments will be available and should be consumed only in the lobby area from 10:35am – 11:05am10:35am-10:50amInternational Supply ChainTechnical Innovations to Improve Supply Chain Security
Dr. PR “Chidi” Chidambaram, Vice President of Engineering and Fellow, Qualcomm10:50am-11:05amGovernment Morning SessionMr. Stephen Welby, Deputy Director for National Security, White House Office of Science and Technology Policy (OSTP)11:05am-12:20pmSecurity in the Face of Microelectronics Supply ChainSession Introduction
Dr. James Wilson, Program Manager, DARPA/MTO

Lightning Talk: Microelectronics Threats and Vulnerabilities – DoD
Mr. Adam Hauch, Microelectronics Security and Counterintelligence Support Technical Lead, U.S. DoD

Lightning Talk: Commercial Microelectronics Security Challenges
Mr. Jason Moore, Engineering Senior Director, Advanced Micro Devices (AMD)

Real-World Security in Practice
Dr. Benjamin Cyr, Senior R&D Cybersecurity Engineer, Sandia National Laboratories

Security Challenges After Integration
Moderator: Dr. Lok Yan, Program Manager, DARPA/MTO
Ms. Cheri Caddy, Deputy Assistant National Cyber Director for Cyber Technology, R&D, Office of the National Cyber Director
Dr. Kevin Fu, Professor of Electrical and Computer Engineering, Computer Sciences, and Bioengineering, Northeastern University and KRI Kostas Research Institute for Homeland Security
Mr. Jason Williams, Co-Founder and Chief Executive Officer, Cromulence, LLC

No Trade-off Necessary: Security, Performance, Ultra-Low Energy, and Assurance
Dr. Joseph Kiniry, Principal Scientist, Galois
Demo: Galois’s 21CC Project

Lightning Talk: Protecting Data with Encryption
Dr. Kurt Rohloff, Co-Founder and Chief Technology Officer, Duality Technologies12:20pm-12:30pmDARPA Session
Importance of Microelectronics in the Strategic Technology Office
Dr. Whitney Mason, Deputy Director, DARPA/STO12:30pm-12:40pmInternational Supply ChainSupply Chain Challenges – Defense Systems
Dr. Bill Carter, Vice President, Materials and Manufacturing Technology, Boeing12:40pm-2:30pmPoster/Demo Lunch SessionPlease visit the demos and posters in our Exhibit Hall for live group discussions with program managers and performers.2:30pm-3:00pm(Meet Us At) The Intersection of Mission and CommerceSession Introduction
Dr. Todd Bauer, Program Manager, DARPA/MTO

Challenges & Opportunities for VLSI Electronics Operating in Cryogenic Environments
Dr. Daniel Friedman, Senior Manager and Distinguished Research Scientist, Communication Circuits and Systems, IBM

High Temperature: The Next Frontier of Computing for a Cleaner World
Dr. Matt Francis, President and Chief Executive Officer, Ozark Integrated Circuits, Inc.3:00pm-3:30pmConnecting Technology to Future System Needs3D Microelectronics Research and Packaging
Dr. Patty Chang-Chien, Vice President and General Manager, Boeing Research and Technology

Impact of 3D Heterogeneously Integrated Microsystems on Analog, Mixed-Signal, and RF Applications and Capabilities
Dr. Ahmad Bahai, Senior Vice President and Chief Technology Officer, Texas Instruments3:30pm-3:50pmAfternoon Break3:50pm-4:00pmDARPA SessionDr. Dev Palmer, Deputy Director, DARPA/MTO4:00pm-4:20pmClosing SessionMr. Mark Papermaster, Chief Technology Officer and Executive Vice President, AMD4:20pm-4:30pmClosing RemarksDr. Mark Rosker, Director, DARPA/MTO4:30pm-5:30pmPoster/Demo Networking Reception5:30pm-6:30pmMTO Recruitment Information ReceptionPlease meet on the 7th Floor Foyer of the Hyatt Regency Seattle6:30pmDay 2 Concludes

Thursday, August 24, 2023

Workshop descriptions located within the “Workshops” page underneath “Conference Details”7:00am-8:30amBreakfast8:30am-3:30pmAll-Day WorkshopsA New Approach to Microelectronics Workforce Development for Government
Dr. James Wilson, Program Manager, DARPA/MTO
Room: 501 Chiwawa – 5th Floor

Putting the Rad in Radiation Effects
Dr. Todd Bauer, Program Manager, DARPA/MTO
Room: 512 Willapa – 5th Floor

Quantum Integrated Photonics – Opportunities and Challenges
Dr. Justin Cohen / Dr. Jonathan Hoffman / Dr. Gordon Keeler, Program Managers, DARPA/MTO
Room: Columbia C – 3rd Floor

Revolutionizing RF/mmWave Design Automation Through Development and Application of Artificial Intelligence and Machine Learning Tools
Dr. Sung Kyu Lim / Dr. Thomas Kazior, Program Managers, DARPA/MTO
Room: Elwha A – 5th Floor

The Materials Genome Initiative & Microelectronics: Designing the Next Generation of Materials
Dr. James Warren, Director of the Materials Genome Project, National Institute of Standards and Technology (NIST)
Room: 302 Beckler – 3rd Floor

Next-Generation Microelectronics Manufacturing (NGMM) Phase 0
Dr. Carl McCants, ERI Special Assistant to the DARPA Director / Mr. John Blevins, Program Manager, DARPA/MTO
Room: Columbia A – 3rd Floor

8:30am-11:30amHalf-Day WorkshopsCommercial Strategy’s Role in Accelerating Innovations in Next Generation Microelectronics
Col Charles Bris-Bois, USAF, DARPA Commercial Strategy
Room: 506 Samish – 5th Floor

Continuous Collaborative Learning in the Spectrum
Mr. John Davies, Program Manager, DARPA/MTO
Room: Columbia D – 3rd Floor

DARPA Connect
Dr. William Kiser, Executive Vice President, Science and Technology, Applied Research Institute (ARI) / Dr. Ben Griffin, Program Manager, DARPA/MTO
Room: 505 Queets – 5th Floor

Emerging Thermal Metrology Needs for 3DHI Microsystems
Dr. Thomas Kazior / Dr. Yogendra Joshi, Program Managers, DARPA/MTO
Room: Elwha B – 5th Floor

Novel Architectures for Neuro-Symbolic Computation
Dr. Alvaro Velasquez, Program Manager, DARPA/I2O
Room: 502 Cowlitz – 5th Floor

Opportunities and Needs for Cryogenic Computing
Dr. Jason Woo, Program Manager, DARPA/MTO
Room: Quinault – 5th Floor

Microelectronics, Power Electronics & Cybersecurity: Securing the Electric Vehicle and Vehicle Telematics Ecosystem
Ms. Cheri Caddy, Deputy Assistant National Cyber Director for Cyber Technology, Research & Development, ONCD, The White House
Room: 507 Sauk – 5th Floor9:45am-10:15amMorning Break11:30am-12:30pmLunch12:30pm-3:30pmHalf-Day Workshops3D Optoelectronics
Dr. Anna Tauke-Pedretti, Program Manager, DARPA/MTO
Room: Quinault – 5th Floor

DARPA Connect
Dr. William Kiser, Executive Vice President, Science and Technology, Applied Research Institute (ARI) / Dr. Ben Griffin, Program Manager, DARPA/MTO
Room: 505 Queets – 5th Floor

Physics Inspired Computing
Dr. Bryan Jacobs, Program Manager, DARPA/MTO
Room: 502 Cowlitz – 5th Floor

Securing the U.S. Electronics Supply Chain
Mr. Mike Sangillo, Program Manager, DARPA/MTO
Room: Columbia D – 3rd Floor

Thermal Innovations for Next Generation Space-Based Electronics
Dr. Thomas Kazior / Dr. Yogendra Joshi, Program Managers, DARPA/MTO
Room: Elwha B – 5th Floor

1:45pm-2:15pm

Afternoon Break

3:30pm

Adjourn

The Defense Advanced Research Projects Agency (DARPA) is a research and developmentagency of the United States Department of Defense responsible for the development of emerging technologies for use by the military.

The agency was created on February 7, 1958, by President Dwight D. Eisenhower in response to the Soviet launching of Sputnik 1in 1957. By collaborating with academia, industry, and government partners, DARPA formulates and executes research and development projects to expand the frontiers of technology and science, often beyond immediate U.S. military requirements.

I am specifically working with: The Microsystems Technology Office (MTO) core mission is the development of high-performance, intelligent microsystems and next-generation components to ensure U.S. dominance in Command, Control, Communications, Computer, Intelligence, Surveillance, and Reconnaissance (C4ISR), Electronic Warfare (EW), and Directed Energy (DE). The effectiveness, survivability, and lethality of systems that relate to these applications depend critically on microsystems and components.